[ #ITRILABS: 3D IC Research Lab]
ITRI’s 3D IC Research Lab is the first of its kind in Asia, equipped with 12-inch #3DIC core manufacturing TSV (Through-Silicon Via) formation and 3D stacking focuses not only on 3DIC development but also the key capabilities in #Electronic Design Automation (EDA), #IC design, packaging, testing, and pilot lines for systematic development. Learn more at: goo.gl/8T48Wt
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